Concepts in Digital Imaging Technology

Section Overview:

Charge-coupled devices (CCDs), like microprocessor and memory integrated circuits, are fabricated on silicon wafers in a series of elaborate steps using photolithography to define and build various functional elements within the microcircuitry. Each wafer contains tens to hundreds of identical devices, each fully capable of producing a single CCD chip for use in digital cameras. This section of the Olympus Microscopy Resource Center Photomicrography Primer contains links to illustrated discussions of important CCD concepts, which are critical in forming a complete understanding of digital imaging techniques.

Review Articles

Selected Literature References

Digital Imaging Web Resources

As solid-state CCD technology rapidly overtakes traditional film and camera techniques, the number of digital camera manufacturers is constantly expanding to meet the needs of the industry. The links provided in this section point to the important manufacturers, trade magazines, and technical support information.

Contributing Authors

Mortimer Abramowitz - Olympus America, Inc., Two Corporate Center Drive., Melville, New York, 11747.

Kenneth R. Spring - Scientific Consultant, Lusby, Maryland, 20657.

John C. Long, Kirill I. Tchourioukanov, and Michael W. Davidson - National High Magnetic Field Laboratory, 1800 East Paul Dirac Dr., The Florida State University, Tallahassee, Florida, 32310.